Field Service Solutions

Copyright © 2004 Enigma, Inc.

Tuesday, December 9, 2003

Feedback

09Dec03

09:47

3RFTS - reflected power

09Dec03

Heads up- spec drift indicates RF problem in chamber C; Fault #3RFT5. Inspection procedures followed, still indicates high reflected power.

Log

Date

Entry

Symptom

09Dec03

RF-related Spec drift in Ch C

Symptom

09Dec03

High reflected power

Known

09Dec03

Fault Code 3RFTS

#

Who

Who

Data

Reaction / Comment

1

Prod.

(green)

Was test wafer saved per spec?

Go to step 2.

Requal with correct wafer per spec. If fails, go to step 2.

2

Prod.

(green)

Was the wafer map printed from SP1?

Review map for patterns. If yes, call Maint./Eng. to determine next OCAP step. If random, go to step 3.

Reprint map and go to step 3.

3

Prod.

(green)

Was the failing SPC chart printed on fab printer?

Also print companion particle qual chart for this machine (walk or film). Go to step 4.

Print both charts for this machine. Go to step 4.

4

Prod.

(green)

Was the correct wafer type used?

Go to step 5.

Requal with correct wafer per spec. If fails, go to step 1.

5

Prod.

(green)

Was the pre-count below allowed limit?

Go to step 6.

Requal with correct wafer per spec. If fails, go to step 1.

6

Prod.

(green)

Did other tools fail from same box of test wafers?

Determine if bad by running a paired particle test with the present box and a different box of wafers. If fails, go to step 7.

Give failing wafers to Defect Tech to KLA review and go to step 7.

09Dec03